Electroless UBM plating technology for power devices
Essential electroless plating technology for the implementation of power devices, backed by 20 years of know-how!
Our company performs electroless NiP/Au plating on semiconductor wafer Al electrodes, primarily focusing on power semiconductors for automotive applications. To meet customer requirements, we have designed a unique plating cassette and circulation mechanism to improve wafer surface uniformity. Additionally, by achieving a uniform film thickness distribution, we can reduce the inter-chip variation in phosphorus content within the nickel and minimize the variation in nickel consumption during solder mounting. 【Features】 ■ Unique fixtures and equipment that achieve uniform film thickness distribution ■ Reduction of variation in nickel consumption during solder mounting ■ Large equipment compatible with 12-inch wafers ■ Plating suitable for high-temperature mounting/high thermal resistance ■ Electroless copper plating for power devices *For more details, please refer to the PDF document or feel free to contact us.
- 企業：清川メッキ工業
- 価格：Other
